ASSEMBLY
PCB Assembly Solutions: SMT, THT, and Mixed Technology Built to IPC Standards
Comprehensive PCB Assembly Capabilities
AMT provides Surface Mount Technology (SMT), Through-Hole Technology (THT), and Mixed Technology PCB assembly. Unless otherwise specified, all assemblies are built following IPC Standards Class 2.
SMT (Surface Mount Technology):
SMT is ideal for compact, lightweight PCBs manufactured in high-volume runs. It is also well-suited for complex circuits requiring high component density.
THT (Through-Hole Technology):
THT is preferred for prototyping, low-volume production, and components that need strong mechanical connections. It is commonly used for connectors and larger components.
Feature
SMT
THT
Component Placement
Mounted directly on PCB surface
Inserted into pre-drilled holes
Component Size
Smaller, lighter components
Larger components with leads
Assembly Process
Solder paste, pick-and-place, reflow soldering
Manual/automated insertion, wave soldering
Production Speed
Faster (high automation)
Slower (more steps)
Cost
Higher setup, lower per-unit cost at volume
Lower setup, higher per-unit for small runs
Mechanical Strength
Less robust under mechanical stress
Stronger bonds for heavy components
Design Flexibility
Enabled high density, miniaturization
Limited by hole size and spacing
Key Features of Our Box Builds & Electronic Chassis Assemblies
- Combined Electrical & Mechanical
- Soldering, Crimping & Wiring by Using Hand Tools & Automation
- Thorough Testing
- Found in Control Panels, Cable & Harness, Power Supply, Transformer, and Sensor Assemblies
The AMT Difference
Our SMT lines support ultra-fine pitch, BGA, and micro-BGA components, as well as passive components down to 01005. Every SMT assembly undergoes 100% automated optical inspection, with optional X-ray inspection for added assurance.