Pick & Place Universal GSM1 with Flex Jet
Max. Throughput 15,000 parts per hour / 360,000 parts per day
Precision +- 50um @ 5 Sigma
Component range 0.020" to 2.5"
Lead Pitch 0.012"

Screen Printer Semi-Automatic High Precision
Vision Alignment
Automatic Screen Cleaning
Max. Screen Size 29" x 29"
Max. Print Area 20" x 19"

Reflow Oven Five zones plus a separate cooling zone
Combination pin chain/mesh belt conveyor
100% Forced convection heat

Dispensing Fluid Dispensing System
Dispenses solder paste, adhesives, and solder mask
Max. board size 18" x 18"
Auto-Correct Vision
Resolution 0.0005"
Dispensing rate 16,000 dots per hour

SMT Rework Fully Automated High Precision Rework System
Max. Board size 18" x 20"
Full vision align with digital image capture
QFP, BGA, CSP, Flip Chip of Flex Circuits
Digital profile control, closed loop

Microscopes Stereo
Magnification Range x1.8 - x80
Digital Camera

Hand Irons Closed Loop Control Circuit
Short heat up times (8-12 sec.)
High precision programmable

 

 
Cleaning In-Line Aqueous Cleaning System
Closed loop VOC FREE
All blowers and pumps upgraded to maximum HP
Hurricane Jet Upgrade
Cleaning with 100% deionized water

Deionization Rinse Water Recovery System
Five bed system

In-circuit Test Full In-circuit and functional test platform
1024 points
VME architecture
Teradyne, HP, Genrad heads and programs

CAD Software Orcad Version 9.22
Autocad 2000
C-link Version 3
Camtastic LT 2000

Wave Solder Fully Automated Programmable
Chip Wave
Ultrasonic spray fluxer
Mix of Convection and IR preheat
Conformal
Max. Board size 20" x 20"
Coating
Precision spray gun
UV Inspection

Wire Prep High Volume Cut & Strip
Lenths 1 - 99,999 mm
Resolution 0.1 mm
Strip 0.1 - 48 mm

Thermal Real-Time RF Profiling
Profiling
Deviation: 30KHz peak-to-peak
Sensitivity: 105 dbm

Through-Hole Axial & Radial